Surface Mounted Technology
FPC-SMT refers to the application of Surface Mount Technology (SMT) to Flexible Printed Circuit (FPC) manufacturing. It combines the thinness and flexibility of FPCs with the precision and density of SMT, making it a critical technology for miniaturizing and lightweighting electronic devices
Process Flow
FPC Preparation-Stencil Fabrication-Solder Paste Printing-Component Placement-Reflow Soldering
Inspection and Rework
AOI Inspection-X-ray Inspection-Rework
Common Defects
Solder Voiding-Component Shift-Solder Balling-FPC Delamination-Pad Lift-off
FPC Fixturing and Support-Pad Design-Solder Paste Selection-Stress Management
Applications
Consumer Electronics-Automotive Electronics-Medical Devices-Industrial Control
Future Trends
Ultra-Fine Pitch Assembly-Lead-Free and Eco-Friendly-Smart Manufacturing-Novel Materials
Key Technologies