Surface Mounted Technology

FPC-SMT refers to the application of Surface Mount Technology (SMT) to Flexible Printed Circuit (FPC) manufacturing. It combines the thinness and flexibility of FPCs with the precision and density of SMT, making it a critical technology for miniaturizing and lightweighting electronic devices

Process Flow

FPC Preparation-Stencil Fabrication-Solder Paste Printing-Component Placement-Reflow Soldering

Inspection and Rework

AOI Inspection-X-ray Inspection-Rework

Common Defects

Solder Voiding-Component Shift-Solder Balling-FPC Delamination-Pad Lift-off

FPC Fixturing and Support-Pad Design-Solder Paste Selection-Stress Management

Applications

Consumer Electronics-Automotive Electronics-Medical Devices-Industrial Control

Future Trends

Ultra-Fine Pitch Assembly-Lead-Free and Eco-Friendly-Smart Manufacturing-Novel Materials

Key Technologies

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TEL:+86 0755 23725762

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