Multilayer FPC
Multilayer FPC
A multilayer flexible printed circuit (Multilayer FPC) is an advanced flexible electronic component composed of three or more conductive layers alternately bonded with insulating substrates. It achieves vertical interconnection between layers through laser drilling, via filling, and lamination processes
Basic Structure
Basic Structure
Base Material Layer-Conductive Layers-Adhesive Layers-Via Structures-Coverlay-Stiffeners
Process Parameters
Process Parameters
thickness:0.15-0.8MM cu:12um-70um Coverlay colour:white-black-yellow Stiffener:PI-FR4-metal
Advantages
Advantages
Ultra-High Wiring Density-3D Assembly Capability-Superior Signal Integrity-Enhanced Thermal Management
High Cost-Tight Process Window-Extended Design Cycle
Typical Applications
Typical Applications
Premium Consumer Electronics-Automotive Electronics-Aerospace-Medical Electronics
Future Trends
Future Trends
Ultra-Thin Technology-High-Frequency Materials-Embedded Components-Eco-Friendly & Reliable
Limitations
Limitations